The 4th IEEE TEMSCON ASPAC 2025 organizing committee invites researchers, industry professionals, and students to submit papers to this premier conference. The Call for Papers submission deadline is 15 June 2025. This is a prime opportunity for participants to present their research, share insights, and connect with leading minds in technology and engineering management across the Asia-Pacific region and beyond.

About TEMSCON ASPAC: A Premier Regional Forum

TEMSCON ASPAC is a flagship regional conference of the IEEE Technology and Engineering Management Society, dedicated to advancing innovation, leadership, and strategic management of technology. This premier forum draws academics, industry professionals, entrepreneurs, policymakers, and students eager to share insights and explore cutting-edge developments in the field. Over the years, the conference has created an influential platform across the region:

2022 – Bangkok, Thailand
2023 – Bengaluru, India
2024 – Bali, Indonesia
2025 – Returning to Bangkok, Thailand

Each edition has grown in scope and participation, establishing TEMSCON ASPAC as a key player in fostering regional collaboration and leadership in technology and innovation management.

2025 Theme: “Achieving Competitiveness in the Age of AI and Big Data Analytics”

The 2025 edition explores how rapid advancements in Artificial Intelligence and Big Data Analytics are transforming businesses and shaping the future of global competitiveness. TEMSCON ASPAC 2025 will host an Industry Forum that brings together leading voices to discuss challenges and opportunities in this dynamic space. The main tracks include:

Track 1: AI, Machine Learning & Software Engineering
Track 2: Big Data, Analytics & Digital Transformation
Track 3: Technology, Cybersecurity & Industry Applications
Track 4: Entrepreneurship, Business Models & Socioeconomic Impacts

The accepted papers will be submitted for possible inclusion in IEEE Xplore, and selected high-quality submissions will be invited for extended publication in the IEEE Systems Journal.

Exciting Momentum Builds as the Conference Connects 1000+ and counting!

IEEE TEMSCON ASPAC 2025 is gaining tremendous traction. This quarter, the conference proudly surpassed 1,026 LinkedIn followers, a milestone that reflects its rapidly growing community of academics, industry experts, and technology leaders from across Asia-Pacific and beyond. Hosted by the IEEE Technology and Engineering Management Society (TEMS), the 4th IEEE Technology and Engineering Management Society Conference: Asia-Pacific (TEMSCON ASPAC 2025) will take place in the vibrant city of Bangkok, Thailand from 14–16 September 2025.

Therefore, in addition to paper submissions, the conference also welcomes opportunities for sponsorship, volunteer involvement, and panel participation. Further details can be found on the official website: https://2025.aspac-temscon.com/.

“We are thrilled to witness the growing interest in TEMSCON ASPAC 2025. This momentum reflects our community’s shared vision to foster innovation and leadership in engineering management across the Asia-Pacific region.”

— Dr. Nipat Jongsawat
Conference Chair, TEMSCON ASPAC 2025
RMUTT, Thailand